onsemi ENGR STAFF, PACKAGE DEVELOPMENT_TL in Negeri Sembilan, Malaysia
ENGR STAFF, PACKAGE DEVELOPMENT_TL - ( 2203458 )
1.0 KEY RESPONSIBILITIES
Perform Package and Process characterizations and cost effectiveness studies on die attach process.
Addressing and improve product and equipment -specific issues relates to Die attach Process
Responsible in yield improvement and quality project assigned
As a die attach primary point of contact for product-specific engineering issues and acts as a liaison with outside departments including Manufacturing, FAB, Probe, PE, Test and QA
Maintain product quality while developing and introducing package cost reduction programs.
Participate and lead in new package / platform development.
Timely develop/introduce new products with competitive cost/differentiation
To optimize and perform proof of principles independently on existing/newly developed platform/product
Participate and contribute in risk analysis process, as required related to Die attach process
Manage or participate in cross functional or cross department projects and/or teams
Prepare Specification for New Developed Processes and Equipment
Other duties as required by immediate superior from time to time.
Travel may be required.
KNOWLEDGE, SKILLS AND ABILITIES
Possess sound knowledge in 8D, SPC, DOE, FA, DFMEA and analytical knowledge and skills
Knowledge on new package design, process development, product characteristics and sound understanding of equipment capabilities
Independent to lead DOE, analyze information and conclude technical interpretation
Able to postulate potential cause of problem & identify simulation to test the hypothesis
Demonstrated ability to work in fast-paced environment, flexible and capable of making changes while collaborating with cross functional team.
Ability to engage with external suppliers to develop best practices and aware of supplier tools or materials roadmap and competitive landscape
Patent / technical paper published is an added advantage
QUALIFICATION AND EXPERIENCE
Bachelor/Master Degree in Engineering, material science or other technical discipline.
3 years industry experience with semiconductor assembly packaging development
Assembly packaging knowledge in other Front of Line (FOL) processes will be an added advantage.
Primary Location : Malaysia-Seremban-Negeri Sembilan
Job : Engineering
Job Posting : Jul 28, 2022, 4:53:43 AM
Req ID: 2203458
ON Semiconductor is an Equal Employment Opportunity Employer and prohibits discrimination on the basis of age, race, color, religion, gender, sexual orientation, national origin, citizenship, protected veteran status, disability status, or any other federal, state or local protected classes. ON is committed to providing equal employment opportunity to qualified individuals, regardless of protect class status.