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onsemi ENGR STAFF, PACKAGE DEVELOPMENT_TL in Negeri Sembilan, Malaysia




  • Perform Package and Process characterizations and cost effectiveness studies on die attach process.

  • Addressing and improve product and equipment -specific issues relates to Die attach Process

  • Responsible in yield improvement and quality project assigned

  • As a die attach primary point of contact for product-specific engineering issues and acts as a liaison with outside departments including Manufacturing, FAB, Probe, PE, Test and QA

  • Maintain product quality while developing and introducing package cost reduction programs.

  • Participate and lead in new package / platform development.

  • Timely develop/introduce new products with competitive cost/differentiation

  • To optimize and perform proof of principles independently on existing/newly developed platform/product

  • Participate and contribute in risk analysis process, as required related to Die attach process

  • Manage or participate in cross functional or cross department projects and/or teams

  • Prepare Specification for New Developed Processes and Equipment

  • Other duties as required by immediate superior from time to time.

  • Travel may be required.


  • Possess sound knowledge in 8D, SPC, DOE, FA, DFMEA and analytical knowledge and skills

  • Knowledge on new package design, process development, product characteristics and sound understanding of equipment capabilities

  • Independent to lead DOE, analyze information and conclude technical interpretation

  • Able to postulate potential cause of problem & identify simulation to test the hypothesis

  • Demonstrated ability to work in fast-paced environment, flexible and capable of making changes while collaborating with cross functional team.

  • Ability to engage with external suppliers to develop best practices and aware of supplier tools or materials roadmap and competitive landscape

  • Patent / technical paper published is an added advantage



  • Bachelor/Master Degree in Engineering, material science or other technical discipline.

  • 3 years industry experience with semiconductor assembly packaging development

  • Assembly packaging knowledge in other Front of Line (FOL) processes will be an added advantage.

Primary Location : Malaysia-Seremban-Negeri Sembilan

Job : Engineering

Job Posting : Jul 28, 2022, 4:53:43 AM

Req ID: 2203458

ON Semiconductor is an Equal Employment Opportunity Employer and prohibits discrimination on the basis of age, race, color, religion, gender, sexual orientation, national origin, citizenship, protected veteran status, disability status, or any other federal, state or local protected classes. ON is committed to providing equal employment opportunity to qualified individuals, regardless of protect class status.