Job Information
onsemi Wire Bond Process Development Engineer in Lapu-Lapu City, Philippines
Major Duties and Responsibilities:
Responsible for introducing new products from characterization, validation, large scale, qualification, and safe launch for mass production releases in thermosonic and/or ultrasonic wire-bond process
Performs package design review, and risk analysis and conducts studies on materials suitable for the package & process
Review engineering builds requirements and engineering instructions for new products
Responsible for reviewing, generating, updating, and approving specifications
Achieves operational objectives by contributing information and recommendations on new product releases
Preparing and completing assembly build qualification reports, production release documents per device and systems configurations, safe launch reports for initial production released parts
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.