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onsemi ENGR II, PROCESS_TL in Jiangsu, China

ENGR II, PROCESS_TL - ( 2203480 )


  • Responsible for surface-mount technology (SMT), reflow and flux cleaning processes for NPI development projects and post code-s activities

  • Follow projects advance product qualification plan (APQP) phase requirements, provide documentation, line training, and respond to internal and external customers

  • Provide technical advice to development engineer/ leader (technology development (TD) and assembly and test new product introduction (ATNPI) technical lead) as well as other cross-functional team regarding process design, tooling design and process control to reduce the potential risk items impact to quality, yield, cost, and delivery

  • Attend design reviews to brainstorm, analyze, and highlight design potential risk to mass production

  • Review build diagram of new products and derivative products compliance to design rule specs, manufacturability and lessons learned

  • Responsible to raise technical constraints which will have major impact to project quality, cost, yield, and delivery

  • Responsible to secure process-of-record (POR) / bill-of-material (BOM) to meet NPI and back-end (BE) manufacturing key performance metric (KPI) requirements

  • Review, validate, accept / reject design concept from the technology group and package development for new product introduction from design review APQP Phase zero

  • Review, validate, accept / reject characterized POR (process flow, material, and process parameters) established by TD PE based on manufacturing capability on or before line certification

  • Ensure project documents, engineering reports, work-instruction, out-of-control-activity-plan (OCAP) procedure, process parameters, bin limit, tooling drawings are reviewed, and draft are uploaded to database every phase as well as finalized before product release

  • Conduct training to manufacturing, process engineer, technician, operator, and trainer designate before line validation or line certification

  • Be responsible to create mitigation plan involving cross-functional team to quickly resolve issues found during line certification/safe launch/post code-s for the derivative devices

  • Provide report and share to related persons closed loop activities for continuous improvement of NPI by lesson learn, design rule revision and APQP deliverable update

  • Lead the team to use PFMEA/CP/DOE/Red X/Six Sigma as the continuous improvement tools to improve process capability towards zero defects from development to post code-s monitoring

  • Lead the team to improve NPI process quality, address the customer complaints, prevent the recurrence, and improve top process PPM defects

  • Involves process engineering (sustaining) team for post-RTM (release to market) activities on quality, yield, and cost to ensure smooth handover until the project hands over

  • Host buy off and hands over meeting with process engineering and cross-functional team to present post-RTM (release to market) monitor results of yield trends, failure modes with pareto analysis, maverick MRB history, actions, LRR, RMP, compare to Line certification.

  • Responsible to hold MRB meeting when for line shut down by maverick, QCN, OCAP, RMP failure potential failure mode caused by/potentially caused by owned process and provide report and update together with related document in control database

  • Responsible to generate 8D report for customer engineering failure analysis request (EFAR) related to NPI product released within 3 years under ATNPI post-RTM (release to market) monitoring

  • Support customer visit, audits and provide data with the highest priority and urgency

  • Responsible to qualify automotive process and personnel, collaborates with equipment engineering and QA team to qualify automotive designated equipment.

  • Other responsibility to be assigned based on the business need.


  • Bachelor’s in engineering preferably Materials, Chemical or Mechanical Engineering

  • Master’s degree in engineering, chemical or physics is a plus

  • Experience 5 years minimum focused in surface-mount technology (SMT) process

  • 2 years and above experience in sawing process is a plus

  • experience in soft solder or epoxy die-attach is a plus

  • Can independently do machine set-up and buy-off equipment especially platforms: Yamaha SMT, and Disco sawing machines or other equivalent platforms

  • Have deep understanding and hands-on experience of surface-mount technology (SMT)material, tooling equipment and their interaction

  • Have practical and theoretical knowledge on APQP procedure, DFMEA, PFMEA, Control Plan, DOE

  • Have good statistical analysis and decision-making skills

  • Confident and fluent in oral and written both Chinese and English (min CET6)

  • Be able to write good technical/engineering report

  • Have good leadership, interpersonal relationship, and negotiation skills

  • Positive attitude towards work, proactive, self-motivated, open-minded, can work under high pressure

Primary Location : China-CN-Jiangsu Sheng

Job : Engineering

Travel : No

Job Posting : Aug 4, 2022, 7:50:41 PM

Req ID: 2203480

ON Semiconductor is an Equal Employment Opportunity Employer and prohibits discrimination on the basis of age, race, color, religion, gender, sexual orientation, national origin, citizenship, protected veteran status, disability status, or any other federal, state or local protected classes. ON is committed to providing equal employment opportunity to qualified individuals, regardless of protect class status.